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Die Genie

  • Experience the ultimate solution to die measurement challenges with DIE GENIE.
  • The Die Genie is a measuring system for drawing dies, enameling dies, shaped dies, and wires. The Die-Genie is designed modularly and consists of a basic system accompanied by a software module. The measurement is performed optically by use of image processing software.

Die Genie

Die Genie
Die Genie
Die Genie

See Die Genie in Action

DIE GENIE, a device that is very price-competitive yet allows extreme accurate measurement of the diameter of wire drawing dies and optional-shaped dies and wires.

The die measuring system is equipped with a measuring lens. The measuring range of the lenses extends from Φ0.1 to 10 mm. With the genie's high measuring lens, a measurement accuracy of +- 0.002 microns can be achieved.

2D Measuring Range Standard

Φ0.1〜10mm

Inside diameter accuracy

±1µm

Maximum sample height

70 mm

Measurement Speed

1 seconds

Multi zoom magnification

0.7 X to 4X

Illumination

LED Parallel light

Monitor magnification

35X to 225X

Camera

12MP Industrial Camera

Repeatability

-0.001 mm

Machine accuracy

+- 0.002 micron

Platform Load Capacity

20kg

Machine Size

21cm*28cm*68cm

Machine Weight

40kg

Environmental Requirements

Temperature 5〜35℃, Humidity 20％〜80%

Power Supply

220V

  • The die genie has the potential to assess diameter and ovality measurements and is intended for systems without a rotating axis.
  • The Die Genie is a measuring system for drawing dies, enameling dies, shaped dies, and wires.
  • Repeatable and objective results are unaffected by the operator's skill.
  • Rugged construction suitable to be used in a workshop environment.
  • Fast and simple 2D measurement of wire samples, pins, needle angles, etc.
  • It is useful for verification of grinding needle angles, sampling drawn wire, and more.
  • It features reliability and speed in generating measurements, which allows you to check every die before it is put into production, eliminating problems before they occur.
  • Improve wire quality by reviewing the die geometry before and after the wire drawing.
  • Increase production by checking the wire contact point in the die before it draws wire.
  • Physically trace the die on two sides to accurately pick up the die geometry.
  • Store the dies information for statistical data to research its effect on wire quality.
  • Detect poor quality and/or imperfections in the approach angle surface, such as wear rings that other die measuring systems working with light diffraction or lasers can not see.
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