Die Genie

Drawing die geometry measurement involves the accurate assessment of internal dimensions and profiles of wire drawing dies to confirm uniform wire diameter and quality. Sipcon Instruments offers state-of-the-art systems employing optical and digital technologies for measuring parameters such as bearing length, reduction angle, and die profile. All these measurements are essential to maintain product standards in the manufacturing of wire and cable.
Sipcon's equipment provides non-contact, high-resolution inspection with repeatable and precise results. It assists manufacturers in minimizing material waste, optimizing production, and adhering to rigorous quality control. Their systems are easy to use and meet international standards for die measurement accuracy and reliability.

Die Genie

DIE GENIE, a device that is very price-competitive yet allows extreme accurate measurement of the diameter of wire drawing dies and optional-shaped dies and wires.

The die measuring system is equipped with a measuring lens. The measuring range of the lenses extends from Φ0.1 to 10 mm. With the genie's high measuring lens, a measurement accuracy of +- 0.002 microns can be achieved.

Key Features:

Quick and easy 2D inspection of wires, pins, and angles
Accurate and Reliable
Robust structure made for workshop use
Ideal for ovality, diameter checks, and no rotation

2D Measuring Range Standard

Φ0.1〜10mm

Inside diameter accuracy

±1µm

Maximum sample height

70 mm

Measurement Speed

1 seconds

Multi zoom magnification

0.7 X to 4X

Illumination

LED Parallel light

Monitor magnification

35X to 225X

Camera

12MP Industrial Camera

Repeatability

-0.001 mm

Machine accuracy

+- 0.002 micron

Platform Load Capacity

20kg

Machine Size

21cm*28cm*68cm

Machine Weight

40kg

Environmental Requirements

Temperature 5〜35℃, Humidity 20％〜80%

Power Supply

220V

The die genie has the potential to assess diameter and ovality measurements and is intended for systems without a rotating axis.
The Die Genie is a measuring system for drawing dies, enameling dies, shaped dies, and wires.
Repeatable and objective results are unaffected by the operator's skill.
Rugged construction suitable to be used in a workshop environment.
Fast and simple 2D measurement of wire samples, pins, needle angles, etc.
It is useful for verification of grinding needle angles, sampling drawn wire, and more.
It features reliability and speed in generating measurements, which allows you to check every die before it is put into production, eliminating problems before they occur.

Improve wire quality by reviewing the die geometry before and after the wire drawing.
Increase production by checking the wire contact point in the die before it draws wire.
Physically trace the die on two sides to accurately pick up the die geometry.
Store the dies information for statistical data to research its effect on wire quality.
Detect poor quality and/or imperfections in the approach angle surface, such as wear rings that other die measuring systems working with light diffraction or lasers can not see.

Die Genie