SIPCON’s DDI employs an indirect, diffuse illumination system that reveals a clear and detailed image of the drawing die's interior. This innovative approach ensures that even the most subtle imperfections are detected, helping you maintain the stringent quality control standards essential for your wire drawing operations.
With Sipcon's DDI, you have a comprehensive, one-tool solution for addressing the various inspection challenges associated with wire drawing dies, ensuring your equipment operates at peak performance.
Technical specifications:
Observation Head
Trinocular
Eyepiece
10X/20X
Eyepiece Type
Compensating
Vision
5MP
Max Die Diameter
12 mm
Magnification on Eyepiece
7X-45X (14X-90X)
Illumination
Surface: LED
Contour: LED
Operation
Manual
Objective Lens
0.7X-4.5X
Zoom Ratio
6.5:1
Working Distance
90 mm
Construction
Metal Base
Minimum Die Diameter
50 micron (Standard) 30 micron (Optional)
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